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Precision with Magnetron sputtering technology

Magnetron sputtering is a popular technique for thin film deposition, known for its efficiency and versatility. It uses the physical vapor deposition (PVD) process, in which a target material, typically a metal or ceramic, is bombarded with high-energy ions to from a plasma. This bombardment causes atoms from the target to be ejected and then deposited on a substrate, resulting in a thin film. In contrast to cathodic ARC evaporation, droplets do not form during sputtering, surface of the coating is smooth but deposition rate is lower.

Achieve superior coatings with Multipole Variable Magnetic Field

Numerous elements of the magnetic field design are adjusted to meet process requirements. The magnetic field’s strength can be a significant factor. Easy adjustment of the magnetic field from balanced to highly unbalanced provides benefits for hard, decorative or functional coatings.

Multipole magnetic array
Multipole magnetic array designs to flatten the field over the target surface brings very high target utilization to increase machine up-time and reduce material costs. Other benefit is much fewer defects when HiPIMS (High Power Impulse Magnetron Sputtering) is used.
Multipole magnetic array designs to flatten the field over the target surface brings very high target utilization to increase machine up-time and reduce material costs. Other benefit is much fewer defects when HiPIMS (High Power Impulse Magnetron Sputtering) is used.
Our magnetron sputtering cathodes can be powered using DC, MF, or HiPIMS power supplies. DC power provides a constant voltage, ideal for sputtering conductive materials. MF power alternates polarity, suitable for both conductive and insulating materials, reducing heat and improving film quality. HiPIMS uses high power pulses for dense plasma and superior film quality, but requires advanced, costly equipment.
Our magnetron sputtering cathodes can be powered using DC, MF, or HiPIMS power supplies. DC power provides a constant voltage, ideal for sputtering conductive materials. MF power alternates polarity, suitable for both conductive and insulating materials, reducing heat and improving film quality. HiPIMS uses high power pulses for dense plasma and superior film quality, but requires advanced, costly equipment.
Our magnetron sputtering cathodes can be powered using DC, MF, or HiPIMS power supplies. DC power provides a constant voltage, ideal for sputtering conductive materials. MF power alternates polarity, suitable for both conductive and insulating materials, reducing heat and improving film quality. HiPIMS uses high power pulses for dense plasma and superior film quality, but requires advanced, costly equipment.
Our magnetron sputtering cathodes can be powered using DC, MF, or HiPIMS power supplies. DC power provides a constant voltage, ideal for sputtering conductive materials. MF power alternates polarity, suitable for both conductive and insulating materials, reducing heat and improving film quality. HiPIMS uses high power pulses for dense plasma and superior film quality, but requires advanced, costly equipment.

Cutting tool hard PVD coatings

The cutting characteristics can be improved by using Physical Vapour Deposition (PVD) coatings.To satisfy customers demand for achieving highly efficient machining, STATON developed coatings together with geometry design to enhance wear resistance.

Advanced PVD coating machines

Discover the newest generation of OCTOARC and OCTOMAG series PVD coating equipment