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OCTOMAG series
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Precision with Magnetron sputtering technology
Magnetron sputtering is a popular technique for thin film deposition, known for its efficiency and versatility. It uses the physical vapor deposition (PVD) process, in which a target material, typically a metal or ceramic, is bombarded with high-energy ions to from a plasma. This bombardment causes atoms from the target to be ejected and then deposited on a substrate, resulting in a thin film. In contrast to cathodic ARC evaporation, droplets do not form during sputtering, surface of the coating is smooth but deposition rate is lower.
Achieve superior coatings with Multipole Variable Magnetic Field
Numerous elements of the magnetic field design are adjusted to meet process requirements. The magnetic field’s strength can be a significant factor. Easy adjustment of the magnetic field from balanced to highly unbalanced provides benefits for hard, decorative or functional coatings.
